Publications by authors named "KN Tu"

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A Comparison Between Ripening Under a Constant Volume and Ripening Under a Constant Surface Area.
King-Ning Tu, Andriy M Gusak, Qinglei Sun, Yifan Yao

Nanomaterials (Basel)· February 2025

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Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget.
Chuan He, Jingzhuo Zhou, Rui Zhou, Cong Chen, Siyi Jing, King-Ning Tu

Nat Commun· August 2024

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Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO Hybrid Joints.
Wei-You Hsu, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu

Nanomaterials (Basel)· August 2023

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Twin-Boundary Reduced Surface Diffusion on Electrically Stressed Copper Nanowires.
Wei-Lun Weng, Hsin-Yu Chen, Yi-Hsin Ting, Hsin-Yi Tiffany Chen, Wen-Wei Wu, King-Ning Tu

Nano Lett· November 2022

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Uphill Diffusion Induced Point Contact Reaction in Si Nanowires.
Yi-Chia Chou, Lih-Juann Chen, King-Ning Tu

Nano Lett· September 2022

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Artificial intelligence deep learning for 3D IC reliability prediction.
Po-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen, Jing-Chen Tu, Cheng-Che Wu, King-Ning Tu

Sci Rep· April 2022

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Low-Temperature Cu/SiO Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces.
Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, King-Ning Tu

Materials (Basel)· March 2022

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Nanotwin orientation on history-dependent stress decay in Cu nanopillar under constant strain.
Yu-An Shen, Li Chang, Shou-Yi Chang, Y-C Chou, K N Tu

Nanotechnology· January 2022

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Modeling of abnormal grain growth in (111) oriented and nanotwinned copper.
A M Gusak, Kuan-Ju Chen, K N Tu, Chih Chen

Sci Rep· October 2021

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Effect of Bonding Strength on Electromigration Failure in Cu-Cu Bumps.
Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, K N Tu, Chih Chen

Materials (Basel)· October 2021

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Fabrication and characteristics of highly [Formula: see text]-oriented nanotwinned Au films.
Wei-Lan Chiu, Chien-Min Liu, Han-Wen Lin, John A Wu, Y-C Chou, K N Tu

Sci Rep· October 2020

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Tensile Properties and Thermal Stability of Unidirectionally <111>-Oriented Nanotwinned and <110>-Oriented Microtwinned Copper.
Yu-Jin Li, King-Ning Tu, Chih Chen

Materials (Basel)· March 2020

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Tensile Properties of <111>-Oriented Nanotwinned Cu with Different Columnar Grain Structures.
Yu-Jin Li, King-Ning Tu, Chih Chen

Materials (Basel)· March 2020

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Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating.
E-Wen Huang, Hung-Sheng Chou, K N Tu, Wei-Song Hung, Tu-Ngoc Lam

Sci Rep· October 2019

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Copper-Catalyzed Aminoboration from Hydrazones To Generate Borylated Pyrazoles.
Kim N Tu, Scott Kim, Suzanne A Blum

Org Lett· March 2019

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Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu.
Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li, K N Tu, Chih Chen

Materials (Basel)· November 2018

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An Oxyboration Route to a Single Regioisomer of Borylated Dihydrofurans and Isochromenes.
Kim N Tu, Chao Gao, Suzanne A Blum

J Org Chem· September 2018

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Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient.
Jing-Ye Juang, Chia-Ling Lu, Kuan-Ju Chen, Chao-Chang A Chen, Po-Ning Hsu, K N Tu

Sci Rep· September 2018

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Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding.
Chih-Han Tseng, K N Tu, Chih Chen

Sci Rep· July 2018

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Osteoporosis: A Review of Treatment Options.
Kristie N Tu, Janette D Lie, Chew King Victoria Wan, Madison Cameron, Alaina G Austel

P T· February 2018

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Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface.
Chun-Lung Huang, Wei-Lun Weng, Chien-Neng Liao, K N Tu

Nat Commun· January 2018

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Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation.
Yuan-Wei Chang, Yin Cheng, Lukas Helfen, Feng Xu, Tian Tian, King-Ning Tu

Sci Rep· December 2017

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Boron-Heteroatom Addition Reactions via Borylative Heterocyclization: Oxyboration, Aminoboration, and Thioboration.
Adena Issaian, Kim N Tu, Suzanne A Blum

Acc Chem Res· October 2017

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Intermetallic compounds in 3D integrated circuits technology: a brief review.
Syahira Annuar, Reza Mahmoodian, Mohd Hamdi, King-Ning Tu

Sci Technol Adv Mater· September 2017

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Approaching the ideal elastic strain limit in silicon nanowires.
Hongti Zhang, Jerry Tersoff, Shang Xu, Huixin Chen, Qiaobao Zhang, King-Ning Tu

Sci Adv· August 2016

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