Publications by authors named "Byeong-Rok Lee"

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Volume Shrinkage-Induced Voiding Mechanism During Electromigration of Cu/Ni/Sn-Ag Microbump.
Kirak Son, Gyu-Tae Park, Byeong-Rok Lee, Young-Bae Park

J Nanosci Nanotechnol· January 2020

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Interfacial Reaction Characteristics of Au Stud/Sn/Cu Pillar Bump During Annealing and Current Stressing.
Jun-Beom Kim, Byeong-Rok Lee, Sung-Hyuk Kim, Jong-Myeong Park, Young-Bae Park

J Nanosci Nanotechnol· November 2015

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