Publications by authors named "Chanhyuk Lim"

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Damage-free dry transfer method using stress engineering for high-performance flexible two- and three-dimensional electronics.
Yoonsoo Shin, Seungki Hong, Yong Chan Hur, Chanhyuk Lim, Kyungsik Do

Nat Mater· October 2024

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Tissue-like skin-device interface for wearable bioelectronics by using ultrasoft, mass-permeable, and low-impedance hydrogels.
Chanhyuk Lim, Yongseok Joseph Hong, Jaebong Jung, Yoonsoo Shin, Sung-Hyuk Sunwoo

Sci Adv· May 2021

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Materials engineering, processing, and device application of hydrogel nanocomposites.
Gi Doo Cha, Wang Hee Lee, Chanhyuk Lim, Moon Kee Choi, Dae-Hyeong Kim

Nanoscale· May 2020

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