Publications by authors named "Chih-Ping Hu"

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Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity.
Yu-Chi Sung, Chih-Ping Hu, Sheng-Jye Hwang, Ming-Hsien Shih, Wen-Hsiang Liao

Polymers (Basel)ยท July 2025

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