Publications by authors named "Do-Seok Kim"

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Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate.
Min-Soo Kang, Do-Seok Kim, Young-Eui Shin

Materials (Basel)· March 2019

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The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints.
Min-Soo Kang, Do-Seok Kim, Young-Eui Shin

Materials (Basel)· March 2019

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