Publications by authors named "Jan Reboun"

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Comparative analysis of printed electronics technologies in RF and microwave circuits.
Saeedeh Lotfi, Martin Janda, Jan Reboun, Tomas Blecha

Sci Rep· November 2025

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Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials.
David Kalaš, Radek Soukup, Jan Řeboun, Michaela Radouchová, Pavel Rous

Polymers (Basel)· May 2023

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Study of Internal Stress in Conductive and Dielectric Thick Films.
Jiri Hlina, Jan Reboun, Martin Janda, Ales Hamacek

Materials (Basel)· December 2022

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Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper.
Jiri Hlina, Jan Reboun, Marek Simonovsky, Tomas Syrovy, Martin Janda

Materials (Basel)· February 2022

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Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications.
Jiri Hlina, Jan Reboun, Ales Hamacek

Materials (Basel)· November 2021

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FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers.
David Kalaš, Karel Šíma, Petr Kadlec, Radek Polanský, Radek Soukup

Polymers (Basel)· October 2021

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