Publications by authors named "Keith Sweatman"

Claim this Profile
I
In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy.
Kazuhiro Nogita, Xin Fu Tan, Jiye Zhou, Stuart D McDonald, Keith Sweatman

Materials (Basel)· August 2025

Social Media Activity not collected for this article yet.

Sign Up to Request Social Media Analysis
G
Ga-Based Alloys in Microelectronic Interconnects: A Review.
Shiqian Liu, Keith Sweatman, Stuart McDonald, Kazuhiro Nogita

Materials (Basel)· August 2018

Social Media Activity not collected for this article yet.

Sign Up to Request Social Media Analysis