Publications by authors named "Martin Schneider-Ramelow"

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Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration.
Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, Tadatomo Suga, Fengwen Mu

Micromachines (Basel)· June 2023

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Recent Advances and Challenges of Nanomaterials-Based Hydrogen Sensors.
Bei Wang, Ling Sun, Martin Schneider-Ramelow, Klaus-Dieter Lang, Ha-Duong Ngo

Micromachines (Basel)· November 2021

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On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.
Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Martin Schneider-Ramelow

Micromachines (Basel)· May 2020

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Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS.
Bei Wang, Manuel Baeuscher, Xiaodong Hu, Markus Woehrmann, Katharina Becker, Martin Schneider-Ramelow

Micromachines (Basel)· April 2020

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Investigation of the Mechanical and Electrical Properties of Elastic Textile/Polymer Composites for Stretchable Electronics at Quasi-Static or Cyclic Mechanical Loads.
Christian Dils, Lukas Werft, Hans Walter, Michael Zwanzig, Malte von Krshiwoblozki, Martin Schneider-Ramelow

Materials (Basel)· November 2019

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Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration.
Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Martin Schneider-Ramelow

Micromachines (Basel)· May 2019

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Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application.
Xiaodong Hu, Piotr Mackowiak, Manuel Bäuscher, Oswin Ehrmann, Klaus-Dieter Lang, Martin Schneider-Ramelow

Micromachines (Basel)· May 2018

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