Publications by authors named "Seongbin Shin"

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High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces.
Fengwen Mu, Zhe Cheng, Jingjing Shi, Seongbin Shin, Bin Xu

ACS Appl Mater Interfaces· September 2019

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Wafer Bonding of SiC-AlN at Room Temperature for All-SiC Capacitive Pressure Sensor.
Fengwen Mu, Yang Xu, Seongbin Shin, Yinghui Wang, Hengyu Xu

Micromachines (Basel)· September 2019

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Patient consent to publication and data sharing in industry and NIH-funded clinical trials.
O'Mareen Spence, Richie Onwuchekwa Uba, Seongbin Shin, Peter Doshi

Trials· May 2018

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