Publications by authors named "Seonghui Han"

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Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).
Sang-Eun Han, Dong-Gyu Choi, Seonghui Han, Tae-Young Lee, Deok-Gon Han

Materials (Basel)· April 2025

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Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.
Seonghui Han, Sang-Eun Han, Tae-Young Lee, Deok-Gon Han, Young-Bae Park

Materials (Basel)· July 2024

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