Publications by authors named "Tim Englert"

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Rapid Detection of Cleanliness on Direct Bonded Copper Substrate by Using UV Hyperspectral Imaging.
Mona Knoblich, Mohammad Al Ktash, Frank Wackenhut, Tim Englert, Jan Stiedl

Sensors (Basel)· July 2024

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UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper.
Mohammad Al Ktash, Mona Stefanakis, Tim Englert, Maryam S L Drechsel, Jan Stiedl

Sensors (Basel)· November 2021

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Use of Hyperspectral Imaging for the Quantification of Organic Contaminants on Copper Surfaces for Electronic Applications.
Tim Englert, Florian Gruber, Jan Stiedl, Simon Green, Timo Jacob

Sensors (Basel)· August 2021

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